Gaia

XSLaren edukia

Mikroelektronika

Gaiari buruzko datu orokorrak

Modalitatea
Ikasgelakoa
Hizkuntza
Gaztelania
Euskara

Irakasgaiaren azalpena eta testuingurua

Basic knowledge about active electronic components, manufacturing processes and technologies in integrated circuits, as well as the use of design tools, mathematical models, analysis and simulation of electronic circuits.

Irakasleak

IzenaErakundeaKategoriaDoktoreaIrakaskuntza-profilaArloaHelbide elektronikoa
AZKONA ESTEFANIA, NEKANEEuskal Herriko UnibertsitateaIrakaslego AgregatuaDoktoreaElebidunaTeknologia Elektronikoanekane.azkona@ehu.eus
JIMENO CUESTA, JUAN CARLOSEuskal Herriko UnibertsitateaUnibertsitateko KatedradunaDoktoreaElebakarraTeknologia Elektronikoajc.jimeno@ehu.eus
OTAEGI AIZPEOLEA, ALOÑAEuskal Herriko UnibertsitateaDoktoreaElebidunaTeknologia Elektronikoaalona.otaegi@ehu.eus

Gaitasunak

IzenaPisua
Capacidad para diseñar y fabricar circuitos integrados.100.0 %

Irakaskuntza motak

MotaIkasgelako orduakIkasgelaz kanpoko orduakOrduak guztira
Magistrala2740.567.5
Gelako p.34.57.5
Ordenagailuko p.1522.537.5

Irakaskuntza motak

IzenaOrduakIkasgelako orduen ehunekoa
Eskola magistralak67.540 %
Gelako praktikak7.540 %
Ordenagailuko praktikak37.540 %

Ebaluazio-sistemak

IzenaGutxieneko ponderazioaGehieneko ponderazioa
Idatzizko azterketa70.0 % 70.0 %
Lan praktikoak30.0 % 30.0 %

Ohiko deialdia: orientazioak eta uko egitea

The evaluation is composed of two parts:

A theory exam for the 70% of the final grade.

A practical laboratory exercise for the 30% of the final grade.

The subject is passed only provided that both parts have been passed separatly (Theory >35%, Laboratory > 15%).

Ezohiko deialdia: orientazioak eta uko egitea

The same that in the ordinary call.

Irakasgai-zerrenda

1. INTRODUCTION TO THE INTEGRATED CIRCUITS.

1.1 Historical evolution of integrated circuits.

1.2 Classification of integrated circuits.



2. MANUFACTURING PROCESSES OF INTEGRATED CIRCUITS.

2.1 Manufacture of integrated circuits.

2.2 Semiconductor substrates. Obtaining monocrystalline silicon.

2.3 Growth of monocrystals. Preparation of the substrate.

2.4 Epitaxial growth. Diffusion of impurities. Ionic implantation.

2.5 Oxidation, deposition of insulators and polysilicon.

2.6 Lithography techniques. Metallization. Encapsulated



3. MOS TECHNOLOGY

3.1 NMOS logic.

3.2 CMOS logic.

3.3 Input and output circuits. Verification.

3.4 Advanced circuits in MOS technology.

3.5 Fundamentals of circuits with switched capacities.

3.6 CMOS logic gate circuits.



4. BIPOLAR TECHNOLOGY.

4.1 Manufacturing process of bipolar integrated circuits.

4.2 Diodes and transistors in bipolar integrated circuits.

4.3 Passive components in integrated circuits.

4.4 Bipolar Logics: TTL, ECL and I2L.

Bibliografia

Nahitaez erabili beharreko materiala

De Diego, J.M. y Jiménez, J., Circuitos Integrados. Notas docentes. Publicaciones ETSI



Aplicaciones instaladas en el centro de cálculo (docentes y de libre disposición) DSCH v2.7f y Microwind v2.6k

Oinarrizko bibliografia

Rabaey, J.M.; Chandrakasan, A.; Nikolic, B. Circuitos Integrados Digitales; Pearson Educación S.A.. 2004.

Gehiago sakontzeko bibliografia

Neil H.E.; Weste and Kamran Esharaghina Principles of CMOS VLSI Design; Addison Wesley; 1993.



Paul R. Gray and Robert G. Meyer; Análisis y Diseño de Circuitos Integrados Analógicos; 3ª Edición; Prentice Hall; 1993. David A. Hodges and Horace G. Jackson; Analysis and Design of Digital Integrated Circuits; 2ª Edición; MacGraw-Hill; 1988

Aldizkariak

Electron Devices, IEEE Transactions on (ISSN: 0018-9383) Electron Device Letters, IEEE ISSN: 0741-3106

Estekak

http://bwrc.eecs.berkeley.edu/classes/icbook/spice www.microwind.org



www.cadence.com

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