Cabecera-Aula

Propuesta Proyectos Aula Chip Curso 2026-27

Oportunidades de realización de TFG, TFM y prácticas en el Aula Chip en colaboración con entidades del sector

Propuesta Proyectos Aula Chip Curso 2026-27

First publication date: 05/10/2026

A continuación se presentan algunos de los títulos de los proyectos propuestos para el curso 2026-27 en el Aula Chip

Optimización de IP neuromórfica para despliegue en ASIC: diseño orientado a PPA desde FPGA a silicio

Desarrollo de un sistema integrado de procesamiento en SoC basado en SNN para algoritmos de visión por eventos 

Diseño de un ASIC Europeo empleando con funcionalidades de Sincronización con precisión de Sub-microsegundo empleando herramientas y PDK de Código Abierto 

Prototipado de un dispositivo SoC con comunicaciones cuánticamente seguras para el establecimiento de conexiones MACSEC entre nodos de comunicación

Diseño de un mecanismo de mapeo de parámetros de calidad de servicio (QoS) entre redes cableadas deterministas TSN y redes inalámbricas 5G implementable dispositivos semiconductores SoC Gateways

Diseño de un dispositivo SoC para el procesamiento de datos proporcionados por sensores de fibra óptica a través un chip óptico experimental (TFG)

Diseño de una placa electrónica para la validación de un chip óptico experimental para sensores de fibra óptica (TFG)

Diseño de una placas electrónicas para la validación de un chip experimentales "bare metal"

Diseño de un dispositivo SOC basado en una CPU RISC-V de 32 bit para el control de servos

Diseño y puesta en marcha de una infraestructura de IA Local para la acelaración de la etapa de verificación en el diseño de dispositivos semiconductores

Desarrollo de un set-up de validación de prototipos de dispositivos SoCs para comunicaciones

Desarrollo del software embebido para configuración de dispositivos SoCs para comunicaciones

Evaluación de PDKs para diseño de semiconductores en nodos avanzados de fabricación utilizando herramientas Open Source

Otro proyectos del ámbito de la Tecnología Electrónica de interés para la Cátedra SoC4sensing

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Chip Chair

The chip classroom is located on the second floor, building two, module 16, with the classroom code (P2M16), of the University of the Basque Country UPV/EHU, Ingenieros.

The SoC4sensing Chip Chair promotes activities to disseminate microelectronics to students, companies, and society. The main objective of these actions is to attract talent to the degrees that graduate professionals need. To this end, the aim is to visualize to society the possibilities offered by developing a professional activity in electronic and microelectronic design.

The Aula Chip, launched from SoC4sensing, is an impact tool for meeting dissemination objectives. This Classroom has the format of the Company Classroom of the School of Engineering of Bilbao.

The Business Classrooms are spaces located in the school itself. They are created to encourage student interest in the entities that sponsor the classrooms and to promote R&D&I activities of interest to the promoters. They are an effective instrument of collaboration between the School of Engineering of Bilbao, through its departments, and the companies, both in activities related to research, technological development, and innovation and in everything related to training, both for future engineers and in activities related to the recycling and continuous training of company personnel. There are currently 12 Company Classrooms.

Therefore, the Aula Chip promotes the visibility of the actions carried out in the Chair to students, companies, and society.

Presentación de la ponencia Chips diseñados en Euskadi y fabricados en UE

Presentación de la ponencia Chips diseñados en Euskadi y fabricados en UE

JORNADA Tecnología y resiliencia: retos y oportunidades, 11/06/2026, TelekoGaua

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Hardware coprocessor integration with NEORV32: characterization for efficient implementation of RISC-V-based AI SoCs

This work, studies the integration of hardware accelerators (coprocessors) into the open-source NEORV32 RISC-V SoC (VHDL) and provides a quantitative comparison of multiple integration mechanisms

First publication date: 16/02/2026

Scheme of the Custom SoC Design.

Performing AI inference ubiquitously requires energy-efficient, small footprint and highly reliable processing devices. Heterogeneous processing architectures combining customized CPUs with domain specific coprocessors can provide a good trade-off between computational efficiency and application f lexibility for edge AI deployments while shortening development times compared to full custom application-specific processor designs. Following the impulse for the European sovereignty in the microelectronics field, in this work we propose the use of a RISCV based open-source hardware platform and Free/Libre and/or Open Source (FLOS) Electronic Design Automation (EDA) tools to evaluate the performance of different coprocessor integration options in a System-on-Chip (SoC) prototyped on FPGA. We tested four integration options (XBUS, Stream, CFS and CFU) to obtain precise data that will allow making the correct design decisions for the future development of integrated devices for high-performance AI at the edge.

Overall, the study concludes that CFU is the most suitable coprocessor attachment mode when minimum latency is the priority (typically 8–13 system clock cycles, depending on the accelerator). In contrast, XBUS is the least favorable in terms of throughput (around one-fifth of the data per clock cycle in the evaluated cases). A key takeaway is that the effect of the accelerator’s internal architecture on latency/throughput depends on the selected integration mode, which can be decisive for design choices: CFU benefits low-internal-latency coprocessors, but its advantage narrows as internal latency increases. At the same time, XBUS can be preferable for buffered coprocessors when targeting the highest data throughput.

 

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Funded by

Plan de Recuperación, Transformación y Resiliencia-Financiado por la Unión Europea-NextGenerationEU. Proyecto financiado por Secretaría de Estado de Telecomunicaciones e Infraestructuras Digitales