La Cátedra SoC4sensing ha permitido dotar al Aula Chip en la Escuela de Ingeniería de Bilbao de una nueva infraestructura para wire-bonding semi-automático de dispositivos semiconductores.
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Description
Description
The SoC4sensing University-Business Chair of the University of the Basque Country (UPV/EHU) aims to promote the training of professionals capable of tackling projects in microelectronic design aimed at our region's most representative productive sectors.
Why the SOCE4SENSING Chair?
To generate new economic activity based on new semiconductor devices that include differential elements for the industrial sectors of which the Basque Country has a deep knowledge.
Nueva infraestructura para Wirebonding de Semiconductores en la Escuela de Ingeniería de Bilbao
Nueva infraestructura para Wirebonding de Semiconductores en la Escuela de Ingeniería de Bilbao
First publication date: 20/04/2026
Se ha instalado en la Escuela de Ingeniería de Bilbao una completa infraestructura que permitirá realizar operaciones de cableado con precisión de micras en dispositivos semiconductores de diferentes tipologías.
El procesos de wirebonding es especialmente importante para los dispositivos semiconductores orientados a sectores críticos, ya que son la fuente más habitual de fallos en los mismos.
Como resultado de las actividades que se están impulsando desde la Cátedra, se han podido diseñar y fabricar prototipos de chips ("tapeouts") con los que es posible experimentar los procesos de wirebonding, avanzando un nuevo paso las capacidades de nuestros alumnos e investigadores en un sector clave para el futuro de nuestra economía y sociedad.
Esta infraestructura está compuesta por una máquina semiautomática de bonding que incorpora mecanismos de visión artificial y ópticos para controlar los procesos involucrados. Esta máquina dispone de un sistema de intercambio de cabezales mediante el cual es posible incorporar capacidades de bonding para semiconductores de nodos avanzados o para semiconductores de electrónica de potencia. Además, permite incorporar cabezales para realizar operaciones de testing sobre los cables y soldaduras realizadas.
La infraestructura se ha completado con cabinas de filtradoras de aire, con un laboratorio auxiliar de soldadura limpia y con un software específico para analizar las deformaciones en el proceso de bonding.
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Erdieroalezko gailuen Wirebonding-eko prestakuntza
Erdieroalezko gailuen Wirebonding-eko prestakuntza
First publication date: 24/03/2026
2026ko apirilaren 15, 16 eta 17an Bilboko Ingeniaritza Eskola ospatuko da "Semikonduktoreen gailuen Wirebonding-ari buruzko Workshopa", EMEA electrosolutions S.L. enpresako teknikari espezialistek emana.
Txip erdieroale baten padak (metalezko kontaktu txikiak) eta kapsulatuaren terminalak elektrikoki konektatzeko prozesua da wirebonding-a, hari oso finak erabiliz.
Prestakuntza horretan, SoC4sensing Katedraren wirebonding azpiegitura erabiliko da.
X-HEEP-en oinarritutako SoCs gailuen diseinua
X-HEEP-en oinarritutako SoCs gailuen diseinua
First publication date: 23/03/2026
2026ko martxoaren 26an, "X-HEEPen oinarritutako SoCs gailuen diseinuari buruzko Workshop" egingo da Madrilgo Unibertsitate Politeknikoko ikertzaileen eskutik, Bilboko Ingeniaritza Eskolan.
X ‑ HEEP plataforma irekia da, RISC ‑ V plataforman oinarritua, energian oso konfiguragarriak eta eraginkorrak diren mikrokontrolagailuak sortzeko diseinatua, eta ezin hobea da ertzean eta TinyAIn konputazio-proiektuetarako.
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Board of Trustees
Ikerlan
The Ikerlan Research Center is a cooperative member of the MONDRAGON Corporation and the Basque Research and Technology Alliance (BRTA). Founded in 1974, it focused on transferring knowledge and contributing competitive value to companies. IKERLAN, as a Basque technological center actively participating in research on critical embedded systems, must play a fundamental role in the region's microelectronics strategy, both in general and in this project.
GAIA (Basque Microelecronis Hub)
The GAIA association is a benchmark in the microelectronics offered in the Basque Country, with nearly 40 years of experience in projects and operations linked to its promotion and coordination.
The microelectronics field is a transversal and multidisciplinary knowledge space that integrates diverse and dispersed organizations in the region's economic geography. A significant number of organizations and centers with a microelectronics specialty operate from the activity carried out by other ODCs specialized in energy, machine tools, or health, among others. Partially derived from the above, the activity of GAIA and the rest of the ODCs is complemented by the Basque Microelectronics Hub (BMH) as an ecosystem that arises from GAIA to respond to microelectronic needs and opportunities from a common, transversal, open, international center.
System-on-Chip engineering S.L. (SoCe S.L.)
SoCe is a Bilbao company established in 2010, driven by the APERT research group. It specializes in developing and selling solutions for critical and high-performance communications. It develops its own technology for Deterministic and high-availability Ethernet communications for industrial, energy, aerospace and defense applications. It has a deep knowledge of SoPC-FPGA technology. SoCe has a dual approach to the market: on the one hand, it acts as a technology provider, licensing IP solutions for SoPC-FPGA systems, and on the other, it sells end-use communications equipment in sectors such as industry, defense, and aerospace, among others, through its Relyum brand. This technological differentiation in the market has allowed it to sell in more than 45 countries.
SoCe has a highly specialized staff of more than 25 professionals and is continuously expanding. Its strategic plan is to deploy more economic activity in the microelectronics sector based on the technological differentials it develops.
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Advisory Committee
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Enclosed team
Jon Andreu Larrañaga. View profile
Aitzol Zuloaga Izaguirre. View profile
Jaime Jiménez Verde. View profile
José Ignacio Garate Añibarro. View profile
Victor Enrique Martinez Santos. View profile
Óscar Mata Carballeira. View profile
Leire Magüira Urtubi. View profile
Carlos Cuadrado Viana. View profile
Unai Bidarte Peraita. View profile
Maria Victoria Martinez Gonzalez. View profile
José Ángel Araujo Parra. View profile
Sara Alonso Salazar. View profile
Javier Echanove Arias. View profile
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Funded by
Plan de Recuperación, Transformación y Resiliencia-Financiado por la Unión Europea-NextGenerationEU. Proyecto financiado por Secretaría de Estado de Telecomunicaciones e Infraestructuras Digitales