Natural convective cooling of electronics contained in tilted hemispherical enclosure filled with a porous medium saturated by water-copper nanofluid

Egileak:
A. Baïri, J.G. Bauzin, A. Martín-Garín, N. Alilat, J.A. Millán-García
Urtea:
2019
Aldizkaria:
International Journal of Numerical Methods for Heat and Fluid Flow
Liburukia:
29(1)
Hasierako orria - Amaierako orria:
280 - 293
DOI:
https://doi.org/10.1108/HFF-01-2018-0036

Informazio gehigarria