Thermal state of electronic assemblies applied to smart building equipped with QFN64 device subjected to natural convection
- Authors:
- A. Baïri, L. Roseiro, A. Martín-Garín, K. Adeyeye, J.A. Millán-García
- Year:
- 2017
- Journal:
- Microelectronics Reliability
- Volume:
- 70
- Initial page - Ending page:
- 79 - 83