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The proposed Training Plan covers training activities for the following degrees of the Bilbao School of Engineering:

Bachelor's and Master's Degrees in Telecommunications Engineering
Master's Degrees in Advanced Electronic Systems
Doctoral Programs in Electronics and Telecommunications
Doctoral Programs in Physical Engineering
Business and Entrepreneurship.

The objectives of the training plan are to strengthen and expand the presence and contribution of highly qualified professionals in the field of telecommunications and advanced electronics, promoting innovation and economic development in the industry.

Erdieroalezko gailuen Wirebonding-eko prestakuntza

First publication date: 24/03/2026

2026ko apirilaren 15, 16 eta 17an Bilboko Ingeniaritza Eskola ospatuko da "Semikonduktoreen gailuen Wirebonding-ari buruzko Workshopa", EMEA electrosolutions S.L. enpresako teknikari espezialistek emana.

Txip erdieroale baten padak (metalezko kontaktu txikiak) eta kapsulatuaren terminalak elektrikoki konektatzeko prozesua da wirebonding-a, hari oso finak erabiliz.

Prestakuntza horretan, SoC4sensing Katedraren wirebonding azpiegitura erabiliko da.

Document

(Opens New Window)Invitacion-Workshop on wirebonding-_ES_260324.pdf (pdf, 517.18 Kb)

X-HEEP-en oinarritutako SoCs gailuen diseinua

First publication date: 23/03/2026

Photo: X-HEEP: An Open-Source, Configurable and Extendible RISC-V Platform for TinyAI Applications - Scientific Figure on ResearchGate. Available from: https://www.researchgate.net/figure/HEEP-architecture-with-integrated-accelerators-and-co-processor_fig1_394940928

2026ko martxoaren 26an, "X-HEEPen oinarritutako SoCs gailuen diseinuari buruzko Workshop" egingo da Madrilgo Unibertsitate Politeknikoko ikertzaileen eskutik, Bilboko Ingeniaritza Eskolan.

X ‑ HEEP plataforma irekia da, RISC ‑ V plataforman oinarritua, energian oso konfiguragarriak eta eraginkorrak diren mikrokontrolagailuak sortzeko diseinatua, eta ezin hobea da ertzean eta TinyAIn konputazio-proiektuetarako.

Document

(Opens New Window)Invitacion-Workshop on X-heep_soc_Desgin-_ES_260323.pdf (pdf, 512.96 Kb)

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**Call for Master's and Bachelor's Theses through Aula Chip 2025-2026.**

Through the SoC4sensing Chip Classroom, the list of topics for Master's and Bachelor's Theses for 2025-2026 has been released.

**Call for Master's and Bachelor's Degree Final Projects through Aula Chip 2025**

Through the SoC4sensing Chip Classroom, the offer of topics for Master's and Bachelor's Final Projects has been launched.

CALL FOR SCHOLARSHIPS CHIP CHAIR FOR THE STUDENTS OF THE MASTER DEGREE IN TELECOMMUNICATION ENGINEERING, SPECIALITY IN ELECTRONIC SYSTEMS FOR THE COURSE 2025/2026

CALL FOR SCHOLARSHIPS TO STUDY THE UNIVERSITY MASTER DEGREE IN ADVANCED ELECTRONIC SYSTEMS FOR THE 2025/2026 COURSE

CALL FOR CHIP CHAIR SCHOLARSHIPS FOR STUDENTS STUDYING THE DEGREE IN ENGINEERING IN TELECOMMUNICATION TECHNOLOGY, MAJOR IN ELECTRONIC SYSTEMS FOR THE COURSE 2025/2026

**Incorporation of the new subject "Integrated Electronics" into the engineering teaching program**

Integrated Electronics is a 6-credit elective course taught in Spanish during the fourth year of the Bachelor's Degree in Computer Engineer...

**UNIVERSITY EXTENSION COURSE : DevOps for Hardware**

The course's main objective is to acquire an overview of DevOps tools (GitHub/GitLab), learn about their resources, and acquire skills in their use, particularly for hardware design.

**UNIVERSITY EXTENSION COURSE OFFER: Digital Integrated Circuit Design with FOSS EDA 2025**

The fundamental objective of the course is to provide a practical experience of the design flow of digital integrated circuits with FOSS (Free and Open Source ...

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Funded by

Plan de Recuperación, Transformación y Resiliencia-Financiado por la Unión Europea-NextGenerationEU. Proyecto financiado por Secretaría de Estado de Telecomunicaciones e Infraestructuras Digitales